#Product Trends
Ceramic Package For Sensors
95 96 Alumina Ceramic Package For Sensors
Ceramic is commonly used in packages due to its superior mechanical properties, suitable for small, high density, and surface mountable applications- including accelerometers and angular rate, pressure, optical and RF sensors.
Features:
Air-cavity type hermetic package
Close thermal-expansion Matching provides superior mechanical elasticity and less mechanical stress with silicon MEMS chips
Miniaturized, high-density surface mountable package incorporating multi-layer ceramic technology.
Ceramic Package For Sensors
Applications:
Accelerometers
Angular rate sensors (Avro sensors. vaw-rate sensors)
Pressure sensors
CMOS/ CCD Image sensors
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