#Product Trends
Classification and Characteristics of Ceramic Substrates Commonly Used in Electronic Packaging
Ceramic Substrates Commonly Used in Electronic Packaging
There are many kinds of electronic packaging substrates, and the commonly used substrates are mainly divided into plastic packaging substrates, metal packaging substrates and ceramic packaging substrates. Plastic packaging materials usually have low thermal conductivity, poor reliability, and are not suitable for high requirements. Metal packaging materials have a high thermal conductivity, but the general thermal expansion coefficient does not match, and the price is expensive.
