Pain Points in Thick- and Thin-Film Circuit Fabrication and Ceramic Substrate Advantages

Thick- and Thin-Film Circuit Fabrication and Ceramic Substrate Advantages

In the pursuit of high performance and high reliability in electronic manufacturing, traditional substrate materials have become increasingly unable to meet the ever more demanding requirements. Limited thermal conductivity, poor high-temperature stability and insufficient surface accuracy are becoming the bottlenecks for the development of thick-film and thin-film circuits. Therefore, the industry urgently needs a new type of carrier that combines excellent insulation, efficient heat dissipation, outstanding dimensional stability and ideal surface flatness to support the printing and sintering processes of precision circuits.

Core performance requirements of thick film/film circuits for the substrate:

In the field of high-performance electronics, thick-film and thin-film circuits are two crucial microfabrication technologies. Although their processing paths are different, they both impose many similar and stringent requirements on the substrate materials that carry their circuits.