The First Science and Technology Innovation Cup Basketball Game in Science and Education City

As a core process equipment provider in the fields of semiconductors, precision electronics, automotive electronics and new energy, Mingsai Technology will bring its spot/glue spray solutions for the semiconductor industry to SEMICON KOREA 2024. We sincerely invite all guests to visit Mingsai’s booth (B338, Hall B) ), discuss cooperation and seek innovation and development.

"NEPCON ASIA 2023" Asian Electronic Production Equipment and Microelectronics Industry Exhibition is a well-known professional exhibition in the Asian electronics manufacturing industry. With the innovative concept of "cross-border + core + intelligent manufacturing", this exhibition will bring together 1,200 companies and brands to participate in the exhibition, display...

To assist the development of the semiconductor industry, Mingsai Technology independently developed the SS101 wafer-level dispensing system used in the wafer-level packaging underfill process, the GS600SUA underfill machine used in the FCBGA underfill process, and the SIP packaging encapsulation glue painting process. The GS600DD fully automatic glue spraying machine and...