The 2024 SEMCION Korea exhibition concluded successfully

Focus on the semiconductor industry

To assist the development of the semiconductor industry, Mingsai Technology independently developed the SS101 wafer-level dispensing system used in the wafer-level packaging underfill process, the GS600SUA underfill machine used in the FCBGA underfill process, and the SIP packaging encapsulation glue painting process. The GS600DD fully automatic glue spraying machine and the GS600M fully automatic glue dispensing machine used in the MEMS industry are both core processes for advanced packaging.

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MXM6+764, Wujin District, Changzhou, Jiangsu, China, 213164

Changzhou Mingseal Robot Technology Co.,ltd.

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SEMICON KOREA 2024

We sincerely invite all guests to visit Mingsai booth (B338, Hall B)

As a core process equipment provider in the fields of semiconductors, precision electronics, automotive electronics and new energy, Mingsai Technology will bring its spot/glue spray solutions for the semiconductor industry to SEMICON KOREA 2024. We sincerely invite all guests to visit Mingsai’s booth (B338, Hall B) ), discuss cooperation and seek innovation and development.

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Products associated

fully-automatic adhesive dispensing machine

GS600M

liquids dosing dispenser

GS600DD

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