Unleash the power of Conprofe Ultrasonic Hybrid Solutions presented @ SEMI-e 2024 in Shenzhen!

SEMI-e 2024 in Shenzhen!

From June 26th to 28th, the SEMI-e 2024 (The 6th Shenzhen International Semiconductor Exhibition) had staged in Shenzhen International Exhibition & Convention Center (Bao’an District). Conprofe carried its self-developed products and Conprofe Solutions @ SEMI-e.

Conprofe Ultrasonic CNC Machine Tools, Ultrasonic Technology, Super-Hard Cutting Tools, Precision Tool Holders, Precision Parts and other star products are all unveiled to meet customers’ needs in an all-round way, assisting the semiconductor industry to enhance quality and efficiency.

It is a high requirement of workpiece surface quality and nanometer-level accuracy that we are supposed to reach in semiconductor part machining. What commonly-used semicon-materials are single-crystal silicon, polysilicon, silicon carbide, quartz glass, ceramics, AISiC and other hard-brittle materials. It is generally vulnerable to machining problems including chippings, short tool life and low efficiency.

Facing with these issues, Conprofe integrates self-developed Ultrasonic CNC Machine Tools, Ultrasonic Machining Technology and Solid PCD Cutting Tools to customize professional Hybrid Solution for customers in the semiconductors, effectively resolving the difficulties of hard-brittle micro-and-deep holes drilling. Attributed to Conprofe Solution, we finally shorten cycle time, optimize workpiece quality, improve product yield and achieve continuously stable machining.

Single-Crystal Silicon Showerhead Drilling

Single-Crystal Silicon, a hard-brittle material, is vulnerable to chippings and cracks in machining, and its required hole depth-diameter ratio is as high as 55:1. Conprofe combines Ultrasonic Precision Engraving and Milling Machining Center ULM-500 with Ultrasonic Machining Technology and Solid PCD Micro Drill, resulting in over 2,000 ultra-deep micro holes of D0.45x24.75mm with depth-diameter ratio of 55:1. There is also no crack and chipping around hole edges in blind hole machining; Hole roundness could be up to 0.003mm; The hole wall roughness could be down by 99.8%, from Sa 6.54μm to Sa 0.013μm.

Polysilicon Slotted Confinement Ring Machining

Nowadays, polysilicon part is commonly used in chips machining. Manufacturers is highly required to get top level due to a large material removal amount in many procedures and relatively strict requirements for the workpiece surface quality and tolerance.

Taking Polysilicon Slotted Confinement Ring Machining as an example, we will get low efficiency and cracks around groove if we machine the workpiece with traditional method, thus leading to a high scrap rate.

With Ultrasonic Precision Engraving and Milling Machining Center ULM-600, Ultrasonic Machining Technology and DDR Vertical High-Speed Rotary Table, Conprofe successfully tackles customers' machining difficulties. They are satisfied with the result in ultrasonic-assisted machining, such as more stable performance, lower cutting force, higher efficiency, better workpiece surface roughness, less cracks and chippings, and more ideal roundness.

SEE YOU IN THE NEXT EXHIBITION!