Breakthrough in SiC Showerhead Machining! 47.8% Shorter Cycle Time, 160% Longer Tool Life & 50% Cost Reduction

Breakthrough in SiC Showerhead Machining! 47.8% Shorter Cycle Time, 160% Longer Tool Life & 50% Cost Reduction

Conprofe has achieved a groundbreaking innovation in drilling HV3,150-hardness CVD silicon carbide (SiC) showerhead—a critical component in semiconductor manufacturing. Our solution reduces D1.0/D0.5mm stepped hole processing time to just 358 seconds, 47.8% faster than traditional machining technologies, while extending tool life by 160% and cutting machining costs by 50%. This advancement significantly enhances production efficiency for key semiconductor parts!

CVD SiC showerheads are notoriously difficult to machine due to their high hardness and brittleness, leading to long cycle times and high costs. With semiconductor technology progressing to smaller nodes, showerheads face increasing demands for precision and durability, pushing manufacturing techniques toward greater efficiency and cost reduction. In this customer project, the workpiece hardness reaches HV3,150, with extremely small hole diameter, making drilling highly challenging. Traditional methods often cause edge chipping, short tool life, and tool breakage, resulting in scrap parts.

Conprofe’s solution leverages the Ultrasonic-Green Engraving &Milling Center MEM-600, combined with the Ultrasonic Amplitude Measuring Device, Ultrasonic Press-Fit Tool Holder, and high-efficiency Solid PCD Drill, delivering exceptional results:

1. Cycle Time: 358 sec for D1.0/D0.5mm stepped hole—47.8% faster

2. Tool Life: 520 holes per PCD drill with ultrasonic-assisted technology—160% longer lifespan

3. Cost Efficiency: 50% lower machining cost per workpiece

4. Hole Roundness: Exceeds client target (≤0.01mm), with D1.0 hole (37% better) & D0.5 hole (59% better)

5. Hole Positioning Accuracy: D1.0 Hole (80% better) & D0.5 Hole (26% better) than target

6. Hole Concentricity: 48% improvement over requirements

7. Hole Perpendicularity: D1.0 Hole (34% better) & D0.5 Hole (22% better) than target

8. Hole Wall Roughness (Sa): D1.0 Hole (Sa 0.037μm, 63% better) & D0.5 Hole (Sa 0.036μm, 64% better) than target (Sa≤0.1μm)

9. Edge Chipping: ≤0.02mm under 50x microscope inspection

Conprofe’s Ultrasonic Machining Solutions, including the Ultrasonic-Green Engraving & Milling Center, Press-Fit Tool Holders and Solid PCD Drills, are widely applied in semiconductor manufacturing, enabling high-efficiency, high-precision, and low-cost processing of SiC, single-crystal silicon, polysilicon, quartz glass, AlSiC, alumina, aluminum alloy, and more.

Contact us if you face challenges in machining advanced hard-brittle materials and difficult-to-cut metals!

Ms. Esther Hu
Tel/WhatsApp/WeChat: +86-138 2607 9999
Email: [email protected]
Web: www.conprofecnc.com