TELICA: new dual gantry motion system

A solution for semiconductor back-end applications

TELICA is a new multi-axes platform primarily dedicated to semiconductor back-end applications. It is a dual gantry architecture providing motion along 3 degrees of freedom, X, Y and Z, for a total number of 8 controlled axes. It is designed to fulfill the most challenging requirements of advanced die bonding processes (Flip-chip, Fan-out, 3D stacked packages), µ-LED bonding, dispensing applications and more.

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Môtiers, Val-de-Travers, Switzerland

ETEL S.A.

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