New CHARON2 stacked platforms

This module adds four independent degrees of freedom, namely along one rotary, one vertical and two oblique axes. By design, this optional module enables complete fulfillment of wafer motion profiles for advanced semiconductor applications, thus providing OEMs with a turn-key solution for any semiconductor technology.

It is a based solution allowing the users to reach higher throughput, duty cycles or to serve heavier payloads with no loss of repeatability or of accuracy. The standardized product are shaped with XY and XYT configurations which, thanks to footprint, allow easier drop-in solutions to equipment with lower dynamics stages.

TELICA is a new multi-axes platform primarily dedicated to semiconductor back-end applications. It is a dual gantry architecture providing motion along 3 degrees of freedom, X, Y and Z, for a total number of 8 controlled axes. It is designed to fulfill the most challenging requirements of advanced die bonding processes (Flip-chip, Fan-out, 3D stacked packages), µ-LED bon...