New CHARON2 stacked platforms

This module adds four independent degrees of freedom, namely along one rotary, one vertical and two oblique axes. By design, this optional module enables complete fulfillment of wafer motion profiles for advanced semiconductor applications, thus providing OEMs with a turn-key solution for any semiconductor technology.

By combining ETEL’s high efficiency torque motors with HEIDENHAIN’s high resolution encoder technology in a very compact package, the RTMBi delivers industry-leading torque density with high positioning accuracy. With lower inertia and increased continuous torque, ETEL’s indexing tables are now capable of even higher dynamics and shorter indexing times, resulting in inc...

TELICA is a new multi-axes platform primarily dedicated to semiconductor back-end applications. It is a dual gantry architecture providing motion along 3 degrees of freedom, X, Y and Z, for a total number of 8 controlled axes. It is designed to fulfill the most challenging requirements of advanced die bonding processes (Flip-chip, Fan-out, 3D stacked packages), µ-LED bon...