Vertiv™ CoolChip Fluid Network Rack Manifolds Empowering Efficient Data Center Liquid Cooling

304L Stainless Steel Manifolds Connect CDUs to Cold Plates—The Backbone of Scalable, Reliable Liquid Cooling

Vertiv™ CoolChip Fluid Network Rack Manifolds deliver a clean, efficient path between servers and CDUs. Built from 304L stainless steel, these zero-U in-rack manifolds feature drip-free quick connectors, air release and drain valves, plus top/bottom connections for rack- and row-level cooling. Row-based manifolds form the backbone of the Secondary Fluid Network, distributing coolant from CDUs to cold plates with scalability, reliability, speed and OEM/ODM customization. Intelligent monitoring enables leak detection and predictive maintenance. EXTRCOOL offers dual-mode CDUs, manifolds, cold plates, rear door heat exchangers, dry coolers and containerized systems for high-density AI and HPC data centers.

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Area 51, NV, USA

EXTRCOOL INDUSTRY LIMITED

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