JINPAT pancake slip rings, PCB slip ring, platter separate slip ring for exhibit/display

Technical Breakthrough of JINPAT Integral PCB Slip Ring

With the development of industrial technology, thin thickness, light weight and small size are required for slip rings. But the thickness has been a tough nut because of restrictions of internal structure and special parts. Recently, JINPAT Research Center has broken through the bottleneck by structural and technical innovation and many tests.

Such PCB slip rings obtained the full affirmation and praise of customers for high precision, low noise, long lifetime, compact structure, stable performance, high reliability and so on. Its technical parameters has reached the domestic leading position and the foreign advanced level in the same industry.

Ultrathin integral PCB slip ring:

1. With through bore φ30 mm, OD φ68 mm, thickness only 14 mm

2. Capable of 2 circuits @ 5A, dynamic resistance fluctuation value lower than 3mΩ

3. IP54 or higher

4. Starting torque: ≤0.3N.m

5. Working temperature: -40℃~+80℃

6. Shock resistance: the obverse and the reverse can bear over 200 times of shock

7. Anti-seismic property: vibration frequency 2Hz~5Hz (max. 13.2Hz, error value ±1mm

8. Test-proofed lifetime over 10 million revolutions

9. Capable of transmission of power, signals (including Ethernet, USB)