Neousys Launches POC-700-FT Series, A Flattop-Heatsink Compact Fanless Computer with Intel® Alder Lake Core i3-N Processor

Neousys POC-700-FT compact fanless PC with flat-top heatsink, Intel Core i3-N/Atom x7425E processors, ideal for edge computing in space-constrained environments, offering efficient thermal dissipation and flexible I/O expansion.

Neousys Technology, an industry-leading provider of rugged embedded systems, has released its latest compact, fanless computer with a flat-top heatsink design — POC-700-FT series. Built on Intel® Alder Lake Core i3-N or Atom® x7425E processors, the POC-700-FT delivers low-power-consumption computing performance while maintaining a small footprint, making it ideal for space-constrained environments for edge computing applications. Its innovative design leverages direct contact with the cabinet to conduct heat to the surface, ensuring efficient thermal dissipation.

POC-700-FT features the unique heat dissipation concept that strategically channels heat to the surface of the cabinet. The flat-top heatsink design reduces the device's overall dimensions, requiring minimal installation space. By attaching to the cabinet walls, heat is efficiently conducted to the surface for dissipation. This allows the POC-700-FT to easily fit into confined spaces while utilizing the cabinet’s walls to enhance thermal dissipation efficiency.

For storage and expansion, the POC-700-FT supports an M.2 2280 M key for SATA SSDs and a mini-PCIe socket for WiFi, LTE/5G, or CAN bus devices. Additionally, the POC-700-FT series features Neousys' flexible MezIO® expansion module design, an interface engineered to integrate application-specific I/O functions into embedded systems. With MezIO®, users can expand COM, USB 3.1 Gen 1, ignition power control, or SATA ports for 2.5" HDD/SSD, tailored to your specific needs.