Exhibition Recap: Sanwood Technology Drives High-Quality Development in the Semiconductor Industry

Sanwood Technology actively participated in the China International Semiconductor Packaging and Testing Conference & Advanced Semiconductor Packaging Exhibition

On March 25, 2025, the China International Semiconductor Packaging and Testing Conference & Advanced Semiconductor Packaging Exhibition officially opened in Shanghai's Pudong district. As a company specializing in environmental simulation testing equipment, Sanwood Technology actively participated in the event, engaging with industry experts and upstream/downstream enterprises to discuss semiconductor packaging and testing trends and explore collaboration opportunities under the backdrop of domestic substitution.

Exhibition Highlights

The exhibition floor was bustling with energy, drawing semiconductor packaging and testing companies, research institutions, and experts from across the globe. Attendees gathered to explore the latest technological advancements and industry trends.

At the Sanwood Technology booth, our team enthusiastically introduced our environmental simulation testing equipment to visitors. These devices simulate various extreme conditions—such as high/low temperatures, humidity, and more—to provide comprehensive reliability testing for semiconductor packaging and testing products. Many attendees expressed strong interest in our solutions.

Applications of Sanwood Technology’s Equipment

Sanwood Technology’s environmental simulation equipment helps validate the reliability of semiconductor products (e.g., chips) under extreme environmental changes, particularly in demanding applications like automotive electronics and aerospace. Our product lineup includes:

Thermal Shock Test Chamber

High-temperature range: +60°C ~ +150°C

Low-temperature range: -40°C ~ -10°C

Temperature recovery: 5 min

Transition time: ≤10 sec

Upgradable to Thermal Stress Composite Tester (TSC LR/HR)

Three-zone high/low/ambient temperature shock (100 cycles), defrost-free operation reduces testing time and energy consumption.

Note: Temperature uniformity and deviation measured at ambient +25°C, ≤85% RH, no sample.

Highly Accelerated Stress Test (HAST) Chamber

Temperature range: +100°C ~ +155°C

Humidity range: 65% RH ~ 100% RH

Pressure range:0.2~2 kg/cm² (0.05~0.196 MPa)

0.2~3 kg/cm² (0.05~0.294 MPa)

User-friendly program setup and real-time monitoring

Test data exportable to Excel via USB

Technology-Driven, Industry-Forward

The 2025 China International Semiconductor Packaging and Testing Conference provided a valuable platform for industry exchange, offering clearer insights into technological trends and market opportunities. Moving forward, Sanwood Technology will continue to innovate in environmental simulation testing, supporting the semiconductor industry in enhancing product reliability and driving the high-quality development of China’s semiconductor supply chain.