Posted on 2/4/2021
High-Performance Compute, Artificial Intelligence, and Machine Learning are driving a new wave of demand for extremely large and complex chips.
These giant chips – typically over 20B transistors per device – required enormous power draws, which in turn, generates heat. To address these challenges, sophisticated thermal system modelling must be applied, and custom solutions must be design around these models. For device manufacturers, it has become critical to properly manage IC thermal output during the critical...