Posted on 2/3/2025
Finetech, a leading provider of high-precision die attach and bonding equipment, announced its participation in Photonics West 2025, the world’s premier photonics technologies event, taking place in San Francisco from January 28-30.
Finetech, a leading provider of high-precision die attach and bonding equipment, announced its participation in Photonics West 2025, the world’s premier photonics technologies event, taking place in San Francisco from January 28-30.
At booth 4772, Finetech will showcase its latest advancements in die bonding technology, including live demonstrations of the FINEPLACER® f...