Micro-Hybrid’s Expertise in Chip-on-Board Technology

At Micro-Hybrid, Chip-on-Board (COB) technology is one of our core competences.

We combine decades of experience with advanced materials and processes to create high-reliability assemblies that meet the most demanding requirements in microelectronics and sensor applications.

Our COB assembly is carried out on a wide range of substrates, including PCB (for example, rigid-flex, IMS, and metal core), ceramics such as Al₂O₃, LTCC, and HTCC, as well as thin films on ceramics or glass, metal cans, and MCM housings. For every specification, we define and use the most suitable materials to ensure optimal performance and long-term stability.

We process components in all common delivery forms, from bare dies such as actives, MEMS, LEDs, MMICs, and capacitors, to IR filters, windows, and other specialty glass parts. Our die attach processes use a variety of adhesives - conductive, isolating, or flexible - precisely selected to match the electrical, thermal, and mechanical requirements of each application.

In wire bonding, we apply both wedge-wedge and ball-wedge technologies with different thin and heavy wires, achieving reliable interconnections for every design.

With this broad COB competence, Micro-Hybrid delivers miniaturized, durable, and high-performance electronic assemblies that excel in challenging environments and across diverse industries.