SANWOOD Semiconductor Reliability Test Equipment at SEMICON Europa 2026

Visit SANWOOD at Hall C2, Booth 130, at SEMICON Europa 2026 in Munich to discuss memory burn-in, IC temperature characterization, and HAST for semiconductor package qualification.

SEMICON Europa 2026 is underway at Messe München in Munich, Germany, from November 10–13, 2026. SANWOOD is meeting with reliability engineers, lab managers, and equipment buyers at Hall C2, Booth 130 (C2/130) to discuss semiconductor reliability testing. The team is available to review test setups for powered memory burn-in, localized IC temperature testing, and accelerated moisture exposure for semiconductor packages.

The exhibition brings together the teams responsible for chip design, wafer fabrication, packaging, and test. The Advanced Packaging Conference covers chiplet architectures, advanced integration, and developments in packaging and test, while the Fab Management Forum addresses manufacturing strategy and automation. At the SANWOOD booth, the discussion starts with the device or assembly to be tested, the conditions the equipment needs to provide, and the measurements the lab needs to make.

Memory burn-in with powered boards
Memory burn-in can help screen for early-life failures by operating devices under defined stress conditions. When several populated burn-in boards run together, board spacing and heat generated by the powered devices can affect airflow and temperatures across the load. Those details matter when the lab plans how many boards to run per batch and where to check temperature.
For a discussion about the SANWOOD BIB Memory Burn-in Test System, bring the intended board count, the board layout, and the expected heat load if known. These inputs help define the loaded configuration to review against the test profile.

Localized temperature control for IC characterization
The SANWOOD Temperature Forcing System directs hot or cold air to a selected component or test area while the device remains connected to its test board. The system can control the supplied air temperature or use feedback from the device under test, depending on the procedure.
For a test that specifies package-surface temperature, the lab needs to define the sensor location and when to take the electrical readings. The supplied air can reach its setpoint before the package reaches the required temperature. A board or fixture drawing helps identify where to attach the sensor and which electrical connections need to remain accessible.

HAST for semiconductor package qualification
A SANWOOD HAST Test Chamber provides a pressurized environment with elevated temperature and humidity for evaluating moisture-related reliability in non-hermetic semiconductor packages. The selected test method defines the exposure conditions, whether electrical bias is applied, and when electrical measurements are required.
For biased HAST, bring the planned fixture layout and bias requirements. The sample arrangement, wiring, and chamber feedthrough requirements are practical starting points for reviewing the chamber configuration.

Meet SANWOOD at Booth C2/130
Visit Hall C2, Booth 130 to discuss your semiconductor reliability testing project. A draft test profile, board layout, or fixture sketch is enough to start the conversation. For enquiries outside the exhibition, contact [email protected].