Posted on 5/17/2023
DPC (Direct Plated Copper) Metallized AlN Aluminum Nitride Ceramic Substrate
Mainly by evaporation, magnetron sputtering and other surface deposition process to carry on the substrate surface metallization, first under the condition of vacuum sputtering, titanium, and then is copper particles, the plating thickness, then finish making line with ordinary PCB craft, and then to plating/electroless deposition way to increase the thickness of the lin...