Posted on 2/9/2026
The modular platform supports multiple bonding technologies and 12-inch wafers, enabling manufacturers to consolidate diverse advanced packaging processes in one system.
Berlin, January 2026 — The new automated production die bonder is built to deliver stable, repeatable assembly workflows through a flexible architecture that supports C2S, CoB, C2C and C2W processes, using 12-inch wafers as both source and target. By combining these capabilities, it gives semiconductor, photonics and sensor manufacturers a unified platform for handling d...