Posted on 7/15/2025
Finetech proudly introduces the FINEPLACER® femto pro, the next generation in automated multi-purpose bonding technology.
Engineered for high-yield and sustainable mid-volume production, this fully automatic system achieves a placement accuracy of 2.0 µm @ 3 Sigma and supports ultra-low to high bonding forces. With compatibility for a wide range of die attach technologies—including laser-assisted bonding, ultrasonic bonding, adhesive bonding, thermo-compression, eutectic, and reactive solde...