Posted on 6/20/2024
DELO has developed a reliable sealant adhesive for CMOS image sensors, which are often used in driver monitoring systems. Glass filters can be bonded directly to the semiconductor chip using DELO DUALBOND EG6290. The electronics-specified adhesive can be dispensed in narrow, high bondlines, can compensate for temperature-dependent pressure changes, and meets routine automotive standards.
Electronic adhesive with improved properties
The adhesive was specially designed for the glass-on-die assembly method. The glass filter is fixed directly onto the chip, as is typical with iBGA image sensor packaging.
Compared to other products, DELO DUALBOND EG6290 has a significantly higher Young's modulus of 2,350 MPa and significantly higher adhesion value. Due to a...