Posted on 12/2/2019
TriLumina announces the launch of the world’s first 3 W surface-mount, flip-chip, back-emitting VCSEL array without the need for a package submount or bond wires for mobile 3D sensing cameras. This new VCSEL-on-Board (VoB) technology enables higher performance, smaller size and lower costs, and simplifies time-of-flight (ToF) camera supply chains as compared to conventional VCSELs for 3D sensing.
The TriLumina 3 W VoB SMT VCSEL array has the smallest footprint with the lowest cost implementation in its class, making it ideal for use in mobile devices.
Conventional VCSEL arrays are mounted on a submount and use bond wires for electrical connections. The new 3 W VCSEL on board surface mount technology (SMT) device is a compact, surface-mountable design, consisting...